TITLE

Teamwork: The key to success in flip chip design

AUTHOR(S)
Phipps, Gregory
PUB. DATE
December 2002
SOURCE
Solid State Technology;Dec2002, Vol. 45 Issue 12, pS4
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Highlights the importance of teamwork for success in flip chip design. Performance requirements of flip chip designs; Wire bond design process; Chip manufacturing processes; Design rules and processes.
ACCESSION #
8649780

 

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