TITLE

Preceed Introduces New Lead-Free Solder

AUTHOR(S)
Shedd, John
PUB. DATE
December 2002
SOURCE
Circuits Assembly;Dec2002, Vol. 13 Issue 12, p14
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports on the introduction of lead free soldering ball to the surface mount market by Kumamoto, Japan-based Preceed Corp. Constituents of the ball; Melting temperature of the product; Temperature that is considered to be the criteria for practice.
ACCESSION #
8648804

 

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