TITLE

Electromigration-induced plastic deformation in passivated metal lines

AUTHOR(S)
Valek, B. C.; Bravman, J. C.; Tamura, N.; MacDowell, A. A.; Celestre, R. S.; Padmore, H. A.; Spolenak, R.; Brown, W. L.; Batterman, B. W.; Patel, J. R.
PUB. DATE
November 2002
SOURCE
Applied Physics Letters;11/25/2002, Vol. 81 Issue 22, p4168
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed.
ACCESSION #
8528094

 

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