TITLE

Hand Soldering--- The Cause of the Failure?

AUTHOR(S)
Munson, Terry
PUB. DATE
November 2002
SOURCE
Circuits Assembly;Nov2002, Vol. 13 Issue 11, p48
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Discusses reasons behind the failure of hand soldering. Contaminants present in hand-soldered areas; Presence of high levels of weak organic acids in areas soldered by hands; Levels of ionic residues detected in sample boards; Implication of improper heating of a liquid no-clean flux; Care needed while performing no-clean hand soldering.
ACCESSION #
8516676

 

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