Flip Chip Processing Factors

Beddingfield, S. Craig
November 2002
Circuits Assembly;Nov2002, Vol. 13 Issue 11, p22
Trade Publication
Focuses on the importance of the implementation of flip chip technology for electronics manufacturing services (EMS) providers and semiconductor packaging companies. Steps involved in the flip chip assembly process; Factors responsible for flip chip placement accuracy; Aspects of underfill processing.


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