Flip Chip Packaging: A Hot topic

Vardaman, E. Jan
November 2002
Circuits Assembly;Nov2002, Vol. 13 Issue 11, p18
Trade Publication
Presents developments in the flip chip technology in the electronics industry. Adoption of the flip chip technology in various applications; Introduction of semiconductor products based on flip chip technology by graphic chipmakers; Need for large die size in high performance applications; Increase in the number of suppliers for laminate substrates; Growth in a variety of pin counts in flip chip designs.


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