Effect of Curing and Functionalization on the Interface Thermal Conductance in Carbon Nanotube-Epoxy Composites

Varshney, Vikas; Roy, Ajit; Michalak, Tyler; Lee, Jonghoon; Farmer, Barry
February 2013
JOM: The Journal of The Minerals, Metals & Materials Society (TM;Feb2013, Vol. 65 Issue 2, p140
Academic Journal
This study investigates the interface thermal conductance in a functionalized carbon nanotube (CNT)-epoxy composite system and how it is modified when the surrounding matrix is cured. We have used nonequilibrium molecular dynamics simulations to study the interface thermal conductance in both cured and uncured matrices, based on diglycidyl ether of bisphenol F (EPON-862) and diethylenetoluenediamine. The functionalization is modeled using a dynamic crosslinking algorithm and represents a realistic model of the matrix-filler interface. The thermal interface conductance increases linearly with the degree of functionalization up to the studied 2.5% due to stronger thermal coupling between functionalized CNT and the matrix. In addition, it was observed that curing of the matrix increases the interface conductance by 20% relative to the uncured matrix. This increase is attributed to an increase in thermal conductivity of cured epoxy resulting from relative enhancement in nonbonded interactions (originating from volume reduction) and structural rigidity during curing. Our results suggest that the interface conductance can be strongly influenced by the thermal properties of the bulk matrix as well as the interface chemistry of the additives such as CNTs.


Related Articles

  • Composites' conductivity studied.  // Plastics News;6/18/2007, Vol. 19 Issue 16, p14 

    This article focuses on research related to the thermal conductivity of composites conducted at the Air Force Research Laboratory in Dayton, Ohio. The laboratory is turning to carbon nanotubes to solve the problem of poor thermal conductivity at the adhesive joints between structures in...

  • Heat transfer through metal-graphene interfaces. Wejrzanowski, Tomasz; Grybczuk, Mateusz; Wasiluk, Mateusz; Kurzydlowski, Krzysztof J. // AIP Advances;Jul2015, Vol. 5 Issue 7, p1 

    The paper presents the results of Molecular Dynamics (MD) studies of the thermal properties of Cu and Ag composites with single- (SLG) and multi-layered (MLG) graphene. We show that the thermal boundary conductance (TBC) of the metalgraphene interface drops significantly for the systems...

  • Extremely High Thermal Conductivity of Aligned Carbon Nanotube-Polyethylene Composites. Liao, Quanwen; Liu, Zhichun; Liu, Wei; Deng, Chengcheng; Yang, Nuo // Scientific Reports;11/13/2015, p16543 

    The ultra-low thermal conductivity of bulk polymers may be enhanced by combining them with high thermal conductivity materials such as carbon nanotubes. Different from random doping, we find that the aligned carbon nanotube-polyethylene composites has a high thermal conductivity by...

  • Temperature-dependent thermal conductivity of bent carbon nanotubes by molecular dynamics simulation. Huang, Zhengxing; Tang, Zhen'an; Yu, Jun; Bai, Suyuan // Journal of Applied Physics;May2011, Vol. 109 Issue 10, p104316 

    Molecular dynamics simulations were performed to evaluate temperature-dependent thermal conductivity of bent carbon nanotubes. Thermal conductivities of bent nanotubes are predicted to be smaller than those of straight nanotubes. This is due to the suppression of high frequency phonons from the...

  • Thermal conductivities of alumina-based multiwall carbon nanotube ceramic composites. Ahmad, Kaleem; Wei, Pan; Wan, Chunlei // Journal of Materials Science;Sep2014, Vol. 49 Issue 17, p6048 

    Composites incorporating various vol.% (0.0, 1.1, 6.4, and 10.4) of multiwall carbon nanotubes (MWCNTs) in alumina were consolidated by the spark plasma sintering. Their thermal transport properties were investigated over the temperature range 300-800 K as a function of nanotube contents. It was...

  • Two-sided Estimates of Effective Thermal Conductivity of the Composite with Anisotropic Lamellar Inclusions. Zarubin, V. S.; Kuvyrkin, G. N.; Savel'eva, I. Yu. // Science & Education of Bauman MSTU / Nauka i Obrazovanie of Baum;nov2014, Issue 11, p708 

    A scope of composites as engineering and functional materials are largely determined by their mechanical and thermal properties. For composites used in heat-stressed structures exposed to joint intense mechanical and thermal stress, the thermophysical characteristics of the effective thermal...

  • Nonlinear thermal conductance in single-wall carbon nanotubes: Negative differential thermal resistance. Ai, Bao-quan; An, Meng; Zhong, Wei-rong // Journal of Chemical Physics;1/21/2013, Vol. 138 Issue 3, p034708 

    Nonlinear thermal conductance in single-wall carbon nanotubes (CNTs) is investigated by applying the large temperature difference. From the classical molecular dynamics simulations, we observe the occurrence of negative differential thermal resistance (NDTR) in CNTs, namely, there exist a region...

  • Thermal conductivity of carbon nanotube-polyamide-6,6 nanocomposites: Reverse non-equilibrium molecular dynamics simulations. Alaghemandi, Mohammad; Müller-Plathe, Florian; Böhm, Michael C. // Journal of Chemical Physics;11/14/2011, Vol. 135 Issue 18, p184905 

    The thermal conductivity of composites of carbon nanotubes and polyamide-6,6 has been investigated using reverse non-equilibrium molecular dynamics simulations in a full atomistic resolution. It is found, in line with experiments, that the composites have thermal conductivities, which are only...

  • Molecular dynamics simulations of carbon nanotube/silicon interfacial thermal conductance. Diao, Jiankuai; Srivastava, Deepak; Menon, Madhu // Journal of Chemical Physics;4/28/2008, Vol. 128 Issue 16, p164708 

    Using molecular dynamics simulations with Tersoff reactive many-body potential for Si–Si, Si–C, and C–C interactions, we have calculated the thermal conductance at the interfaces between carbon nanotube (CNT) and silicon at different applied pressures. The interfaces are...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics