Use of Flat Mini Heat Pipes for the Thermal Management of High Dissipative Electronic Packages for Avionic Equipments

Zaghdoudi, M. C.; Tantolin, C.; Sarno, C.
July 2011
International Review of Mechanical Engineering;Jul2011, Vol. 5 Issue 5, p843
Academic Journal
An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.


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