Computational Analysis of Mixed Convection Over Heated, Vertical Rectangular Fin Array, at Richardson Number of Unity

Shete, J. P.; Sane, N. K.; Pavithran, S.
July 2011
International Review of Mechanical Engineering;Jul2011, Vol. 5 Issue 5, p834
Academic Journal
Fins are widely used to increase the heat removal from a given structure. Vertical fin arrays losing heat under natural convection and forced convection find important applications in cooling electronic devices. In a few applications both modes have a contribution in cooling. In the current work, numerical analysis of mixed convection from isothermal vertical rectangular fin array, at Richardson number of unity is presented. At this Richardson number, both natural and forced convection modes are comparable. Computations are made for assisting and opposing modes of mixed convection for a range of temperature differences. Other objective of this work is to find the optimum spacing zone. For given temperature differences, Nusselt numbers are small for natural convection and become large for mixed modes, at all spacings. Optimum spacing is found for a range of temperature differences.


Related Articles

  • NUMERICAL SIMULATION OF MIXED CONVECTION IN A RECTANGULAR ENCLOSURE WITH DIFFERENT NUMBERS AND ARRANGEMENTS OF DISCRETE HEAT SOURCES. Ghasemi, Behzad; Aminossadati, Saiied Mostafa // Arabian Journal for Science & Engineering (Springer Science & Bu;Apr2008, Vol. 33 Issue 1B, p189 

    The objective of this paper is to numerically investigate the cooling performance of electronic devices with an emphasis on the effects of the arrangement and number of electronic components. The analysis uses a two dimensional rectangular enclosure under combined natural and forced convection...

  • Keeping Your Enclosure Cool. Jain, Ravi // ECN: Electronic Component News;Feb2005, Vol. 49 Issue 2, p35 

    Focuses on the importance of having an effective cooling strategy which can help in adequately dealing with heat dissipation in electronic and electrical equipment. Occurrence of heat transfer through radiation, conduction and natural or forced convection; Most commonly used cooling methods for...

  • Experimental Investigation of Heated Horizontal Rectangular Fin Array Under Mixed Convection. Taji, S. G.; Parishwad, G. V.; Sane, N. K.; Deshmukh, R. Z. // International Review of Mechanical Engineering;Jan2012, Vol. 6 Issue 1, p104 

    This work is presented on experimental study of heat transfer by natural and mixed convection from horizontal rectangular fin array with variation in spacing. The purpose of present paper is to investigate the possibility of performance improvement of horizontal rectangular fin array in...

  • Effect of periodic imposed heat flux on three-dimensional natural convection in a partially heated cubical enclosure. Lahoucine, BELARCHE; Btissam, ABOURIDA // Applied Mechanics & Materials;2016, Vol. 831, p83 

    The three-dimensional numerical study of natural convection in a cubical enclosure, discretely heated, was carried out in this study. Two heating square sections, similar to the integrated electronic components, are placed on the vertical wall of the enclosure. The imposed heating fluxes vary...

  • Effects of Varying Viscosity and Thermal Conductivity on Steady Free Convective Flow and Heat Transfer Along an Isothermal Vertical Plate in the Presence of Heat Sink. Mahanti, N. C.; Gaur, P. // Journal of Applied Fluid Mechanics;Jan2009, Vol. 2 Issue 1, p23 

    Aim of the paper is to investigate the effects of linearly varying viscosity and thermal conductivity on steady free convective flow of a viscous incompressible fluid along an isothermal vertical plate in the presence of heat sink. The governing equations of continuity, momentum and energy are...

  • new products: cooling devices.  // Electronic Design;10/15/2001, Vol. 49 Issue 21, p93 

    Features several cooling devices. Availability of the dual-fan speed controller from Linear Technology Corp; Performance of the cross-low heat exchangers from Thermacore; Usability of Flopack Version 2.2 from Flomerics.

  • Experimental Investigation of Natural Convection Heat Transfer from an Array of Protruding Heat Sources in A Square Enclosure. Venkatachalapathy, S.; Udayakumar, M. // International Journal of Applied Engineering Research;2009, Vol. 4 Issue 12, p2527 

    Heat transfer by convection with air as a medium is the most widely used technique for the cooling of electronic equipment and many other devices. An experimental study of natural convection heat transfer from multiple, protruding heat sources simulating electronic equipment is conducted. The...

  • Fully automated apparatus to measure the thermal conductivity of liquids by the transient hot-wire method. Kawaguchi, N.; Nagasaka, Y.; Nagashima, A. // Review of Scientific Instruments;Sep85, Vol. 56 Issue 9, p1788 

    A new fully automated apparatus for measuring the thermal conductivity of liquids is described. This apparatus has been developed to meet the needs of industrial applications. The principle of the measurement is based on the absolute transient hot-wire method. All data acquisition and instrument...

  • An Experimental Investigation of Multiple Water and Air Jet Impingement Cooling. Murthy, Niranjan; Krishnan, V.; Reddy, A. Chennakesava // International Journal of Applied Engineering Research;2011, Vol. 6 Issue 6, p849 

    The problem of cooling of electronic components has become a subject of special interest in recent years due to the increasing capacity and rapidly decreasing size of electronic components. Direct contact cooling using multiple jet impingement is considered as the most effective method. The heat...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics