TITLE

Warpage Analysis on Thin Plate by Taguchi Method and Analysis of Variance (ANOVA) for PC, PC/ABS and ABS Materials

AUTHOR(S)
Nasir, S. M.; Shuaib, N. A.; Shayfull, Z.; Fathullah, M.; Hamidon, R.
PUB. DATE
September 2011
SOURCE
International Review of Mechanical Engineering;Sep2011, Vol. 5 Issue 6, p1125
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Tremendous demand on plastic components from injection molding processes with various applications nowadays sometimes leads industries to go for thinner designs that still possess the same strength characteristics as others. As a result, thin plate plastic component is becoming widely used by engineers. The objective of this paper is to examine the various injection parameters and identify the best setting for different materials such as Polycarbonate (PC), Thermoplastic Acrylonitrile Butadiene Styrene (ABS) and Thermoplastic Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) which affect the warpage for Thin Plate Plastic Component using Taguchi Method. For this purpose, Autodesk Moldflow Insight (AMI) software is used to analyze the process parameters based on 4 level and 5 factor Orthogonal Array designed by Taguchi. The five parameters consist of Mold Temperature, Melt Temperature, Injection Time, Packing Pressure and Packing Time. The Signal to Noise (S/N) ratio and Analysis of Variance (ANOVA) method is applied in identifying the best parameter settings and to find the influence of these parameters on warpage issue. In this study, Packing Time is found to be the most significant parameter, regardless of the material used.
ACCESSION #
76109721

 

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