MLF Assembly Challenges

Westby, George
October 2002
Circuits Assembly;Oct2002, Vol. 13 Issue 10, p22
Trade Publication
Assesses the suitability of micro-lead frame (MLF) devices for low profile, high-density radio frequency applications. Effects of the use of solderable terminations in MLF on wetting and stencil printing; Designs of MLF; Capabilities of high-speed placement machine vision systems.


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