TITLE

MLF Assembly Challenges

AUTHOR(S)
Westby, George
PUB. DATE
October 2002
SOURCE
Circuits Assembly;Oct2002, Vol. 13 Issue 10, p22
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Assesses the suitability of micro-lead frame (MLF) devices for low profile, high-density radio frequency applications. Effects of the use of solderable terminations in MLF on wetting and stencil printing; Designs of MLF; Capabilities of high-speed placement machine vision systems.
ACCESSION #
7527204

 

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