TITLE

The Devil's in the Details: Tombstoning Revisited

AUTHOR(S)
Hymes, Les
PUB. DATE
October 2002
SOURCE
Circuits Assembly;Oct2002, Vol. 13 Issue 10, p20
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Presents question and answer advisory on soldering and tombstoning. Benefits of using a nitrogen-enhanced soldering; Relation of tombstoning with variations in wetting forces and speeds; Factors which can contribute to tombstoning.
ACCESSION #
7527201

 

Related Articles

  • Ultrafast intermetallic compound formation between eutectic SnPb and Pd where the intermetallic.... Wang, Y.; Tu, K.N. // Applied Physics Letters;8/21/1995, Vol. 67 Issue 8, p1069 

    Examines the wetting of eutectic tin-lead solder and palladium. Formation of intermettalic compound as lamellae into the molten solder; Role of palladium in enhancing the soldering process; Application of noble metals to electronic packaging technology.

  • Influence of Flux on Wetting Behavior of Lead-Free Solder Balls during the Infrared-Reflow Process. Cho-Liang Chung; Kyoung-Sik Moon; Wong, C. P. // Journal of Electronic Materials;Jul2005, Vol. 34 Issue 7, p994 

    The effects of two different fluxes (A6 and B6) on the wetting performance of Sn-3.5Ag-0.5Cu lead-free solder balls were investigated during the reflow process. Solder ball wetting behavior in real time via an optical microscope coupled with a video recorder during the reflow process was...

  • Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. Wenxing Dong; Yaowu Shi; Yongping Lei; Zhidong Xia; Fu Guo // Journal of Materials Science: Materials in Electronics;Oct2009, Vol. 20 Issue 10, p1008 

    The purpose of this study is to investigate the effects of small amounts of Ni, P and Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. The results indicate that adding trace amounts of Ni, P or Ce element has little influence on the melting temperature of...

  • Morphology of wetting reaction of eutectic SnPb solder on Au foils. Kim, P. G.; Tu, K. N. // Journal of Applied Physics;10/1/1996, Vol. 80 Issue 7, p3822 

    Presents information on a study which investigated the morphology and kinetics the wetting reaction of eutectic tin lead solder on pure gold foils. Background of the study; Methodology of the study; Results and discussion.

  • THE EFFECT OF REFLOW ON WETTABILITY OF Sn 96.5 Ag 3 Cu 0.5 SOLDER. Weltsch, Zoltán; Hlinka, József // Materials Engineering / Materialove Inzinierstvo;2013, Vol. 20 Issue 1, p32 

    Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wetting behavior with lead-free solder. The improvement of the wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature....

  • Pb-Free Hot Air Leveled Solder Coatings. Stevens, Howard; Liyanage, Nimal // Circuits Assembly;Oct2006, Vol. 17 Issue 10, p28 

    This article discusses the use of hot air leveled (HAL) solder coatings for lead(Pb)-free assemblies. Most printed-circuit board are hot air leveled. Several factors should be considered when choosing a Pb-free alloy, such as differences in melting temperature. Reasons for the elimination of...

  • Effect of Indium on Wetting of Sn-Ag Solder and Strength of Copper Joints.  // Welding Journal;Sep2007, Vol. 86 Issue 9, p51 

    The article reports that the Institute of Materials and Machine Mechanics in Slovac Republic has studied the effects of indium addition on wetting of Sn-Ag solder and strength of copper joints. The addition of 9 wt-% indium decreased the melting range of the solder by only 15°C. Shear...

  • The Persistent Problem of Tombstoning. Trip, Harry // Circuits Assembly;Jun2003, Vol. 14 Issue 6, p20 

    Tombstoning of passive chip components during mass reflow soldering process has created problems for circuit assemblers since the beginning of production surface-mount assembly. Early on in surface-mount, tombstoning was a problem usually associated with vapor phase reflow and was attributed to...

  • Recognizing the Causes of Solder Bridging. Schouten, Gert // Circuits Assembly;Mar2007, Vol. 18 Issue 3, p52 

    The article focuses on the factors to be considered in determining the causes of solder bridging. One common source of inadequate solder drainage conditions occurs when residual oxides from the solder remain at the exit of the solder wave because of lack of flux activity. According to the...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics