TITLE

Living Large: Building Big, Bad Backpanels

AUTHOR(S)
Zarrow, Phil
PUB. DATE
October 2002
SOURCE
Circuits Assembly;Oct2002, Vol. 13 Issue 10, p18
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Explains the processes involved in creating extremely large printed circuit board assemblies. Downturn in telecommunication applications; Impact of surface mount technologies on the sizes of PCB; Problems associated with printing large PCB applications.
ACCESSION #
7527194

 

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