TITLE

ChipPAC to Double Capacity in China

AUTHOR(S)
Shedd, John
PUB. DATE
October 2002
SOURCE
Circuits Assembly;Oct2002, Vol. 13 Issue 10, p16
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Outlines the plan of ChipPAC Inc. to double its manufacturing capacity in China. Products manufactured by the company; Leadership of the company in electronics exporting; Efforts of the company to increase local product development.
ACCESSION #
7527160

 

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