Matsushita Develops New Surface Mounting Technology
- SMT flowline. // Electronic News;9/6/93, Vol. 39 Issue 1979, p12
Presents a photograph of the ValuLine surface mount assembly package. DEK 249 screen printer; Philips CSM84 compact surface mounter; Conceptronic forced convection reflow oven; Introductory price; Description of the surface mounter from Philips Industrial Automation.
- Contract manufacturing, new components drive surface mount market. // Control Engineering;Mar98, Vol. 45 Issue 3, p55
Focuses on the continued growth of the surface mount technology market despite a slowdown in capital equipment spending, according to a report by Frost & Sullivan. Projected sales growth from 1997 to 2004; Fastest growing geographic regions.
- Analog's shrinking world. Jung, Walt // Electronic Design;04/01/97, Vol. 45 Issue 7, p169
Provides information about the surface mount (SM) packaging of integrated circuit. SM's advantages over the traditional leaded passive components; Burden experienced by a digital designer on the constraints of SM parts.
- High power dc-dc converters attain viability as surface-mount devices. Mannion, Patrick // Electronic Design;06/23/97, Vol. 45 Issue 13, p60
Reports that dc-dc converters are the final obstacle to fully automated surface-mount assembly of personal computer (PC) boards. Reason for the slow migration of dc-dc converters from through-hole assembly to surface mount; Information on the surface-mount converters developed by Lambda...
- Surface-mount DC-DC converters come of age. Wagner, Michael // Electronic Design;07/07/97, Vol. 45 Issue 14, p107
Discusses the improvement of terminal management which has produced lightweight power converts in a wide range of power ratings, promising lower manufacturing cost and enhanced reliability, with reference to surface-mount technology (SMT). Discussion on the chief obstacle of surface-mount...
- SMT/HYBRID/PACKAGING 2002 to Arrive in Germany. // Circuits Assembly;May2002, Vol. 13 Issue 5, p10
Highlights the SMT/HYBRID/PACKAGING 2002 conference in Nuremberg, Germany. Packaging of optoelectronics and microsystems; Use of the conference and exhibition as a platform to present solutions on system integration in microelectronics.
- Living Large: Building Big, Bad Backpanels. Zarrow, Phil // Circuits Assembly;Oct2002, Vol. 13 Issue 10, p18
Explains the processes involved in creating extremely large printed circuit board assemblies. Downturn in telecommunication applications; Impact of surface mount technologies on the sizes of PCB; Problems associated with printing large PCB applications.
- Component Rework: A Small World and Getting Smaller. Walz, Mark J. // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p32
Focuses on reworking and repairing of micro surface mount devices using various techniques and tools. Dimensions of the electronic board used in the study; Sequences in the rework process; Development of rework thermal process; Removal of defective components.
- Atlanta SMTA Vendor Show Open to Exhibitors. // Circuits Assembly;Mar2003, Vol. 14 Issue 3, p14
Reports that the Atlanta chapter of the Surface Mount Technology Association in Minneapolis, Minnesota is seeking exhibitors at its vendor show scheduled for April 24, 2003. Location for the annual vendor show; Details of the exhibitor cost to companies.