Component Removal and Attachment Issues
- Using lead-free solder. Henkenius, M. // Popular Mechanics;Jun91, Vol. 168 Issue 6, p61
Discusses how the Lead Contamination Control Act has brought solders into use that are a good deal stronger and better than the generations-old tin/lead standby. Tips on using new lead-free solders; Assessing the lead risk; Lead-testing kit.
- Soldering. // Design News;12/26/94, Vol. 50 Issue 25, p573
Lists companies in the United States that manufacture soldering equipment. Alloys; Equipment; Flux.
- A guide to better soldering. Thurber Jr., Karl T. // Popular Electronics;Sep94, Vol. 11 Issue 9, p37
Presents tips for better soldering. Use of the right flux and tools; Accessories; Maintenance of soldering tool; Preparation of the connection and solder; Avoidance of component damage; Desoldering; Special solder jobs. INSET: Names and numbers (electronics companies)..
- Using Solder Fountains. Ferry, Jeff // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p60
Focuses on an increase in usage of solder fountains with the introduction of lead-free solders. Pros and cons of solder fountain; Steps to be followed in working with solder fountains; Rework tips to be followed when working with solder fountain.
- Death of a Battery. Munson, Terry // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p61
Focuses on hand soldering process. Causes of faults in the soldered product; Usage of weal organic acids as fluxes; Appropriate amount of flux to be used in soldering.
- Surface-Mount Solder Attachments. Crawford, Jack; Engelmaier, Werner // Circuits Assembly;Jul2002, Vol. 13 Issue 7, p28
Focuses on the impact of questionable test regimens and extravagant claims for IPC to develop a standard to ensure proper solder joint reliability in the U.S. Importance of design for reliability for proper performance; Identification of the accelerated testing issues; Reliability of the test...
- The Devil's in the Details: Tombstoning Revisited. Hymes, Les // Circuits Assembly;Oct2002, Vol. 13 Issue 10, p20
Presents question and answer advisory on soldering and tombstoning. Benefits of using a nitrogen-enhanced soldering; Relation of tombstoning with variations in wetting forces and speeds; Factors which can contribute to tombstoning.
- Ensuring Reproducibility in Selective Soldering. Diepstraten, Gerjan; Schouten, Gert // Circuits Assembly;Oct2002, Vol. 13 Issue 10, p34
Describes the selective soldering process in detail. Specification limits needed to achieve a reliable and robust selective soldering; Importance of process capability for defining the reproducibility of a process; Use of soldering in the automotive electronics industry.
- Activate Your Solderability Testing Program. Crawford, Jack // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p18
Focuses on solderability test methods. Quality of flux required in the soldering; Reduction in variability in solderability test; Precautions to be taken while soldering; Standardization of solderability tests.