TITLE

Component Removal and Attachment Issues

AUTHOR(S)
Hymes, Les
PUB. DATE
September 2002
SOURCE
Circuits Assembly;Sep2002, Vol. 13 Issue 9, p24
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Provides guidelines on the underfill material in rework, repair and reflow soldering. Importance of understanding solderability in the soldering process; Realization of perceived productivity gain; Application of thermal process approaches.
ACCESSION #
7338732

 

Related Articles

  • Using lead-free solder. Henkenius, M. // Popular Mechanics;Jun91, Vol. 168 Issue 6, p61 

    Discusses how the Lead Contamination Control Act has brought solders into use that are a good deal stronger and better than the generations-old tin/lead standby. Tips on using new lead-free solders; Assessing the lead risk; Lead-testing kit.

  • A guide to better soldering. Thurber Jr., Karl T. // Popular Electronics;Sep94, Vol. 11 Issue 9, p37 

    Presents tips for better soldering. Use of the right flux and tools; Accessories; Maintenance of soldering tool; Preparation of the connection and solder; Avoidance of component damage; Desoldering; Special solder jobs. INSET: Names and numbers (electronics companies)..

  • Soldering.  // Design News;12/26/94, Vol. 50 Issue 25, p573 

    Lists companies in the United States that manufacture soldering equipment. Alloys; Equipment; Flux.

  • Using Solder Fountains. Ferry, Jeff // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p60 

    Focuses on an increase in usage of solder fountains with the introduction of lead-free solders. Pros and cons of solder fountain; Steps to be followed in working with solder fountains; Rework tips to be followed when working with solder fountain.

  • Death of a Battery. Munson, Terry // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p61 

    Focuses on hand soldering process. Causes of faults in the soldered product; Usage of weal organic acids as fluxes; Appropriate amount of flux to be used in soldering.

  • Surface-Mount Solder Attachments. Crawford, Jack; Engelmaier, Werner // Circuits Assembly;Jul2002, Vol. 13 Issue 7, p28 

    Focuses on the impact of questionable test regimens and extravagant claims for IPC to develop a standard to ensure proper solder joint reliability in the U.S. Importance of design for reliability for proper performance; Identification of the accelerated testing issues; Reliability of the test...

  • The Devil's in the Details: Tombstoning Revisited. Hymes, Les // Circuits Assembly;Oct2002, Vol. 13 Issue 10, p20 

    Presents question and answer advisory on soldering and tombstoning. Benefits of using a nitrogen-enhanced soldering; Relation of tombstoning with variations in wetting forces and speeds; Factors which can contribute to tombstoning.

  • Ensuring Reproducibility in Selective Soldering. Diepstraten, Gerjan; Schouten, Gert // Circuits Assembly;Oct2002, Vol. 13 Issue 10, p34 

    Describes the selective soldering process in detail. Specification limits needed to achieve a reliable and robust selective soldering; Importance of process capability for defining the reproducibility of a process; Use of soldering in the automotive electronics industry.

  • Activate Your Solderability Testing Program. Crawford, Jack // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p18 

    Focuses on solderability test methods. Quality of flux required in the soldering; Reduction in variability in solderability test; Precautions to be taken while soldering; Standardization of solderability tests.

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sign out of this library

Other Topics