Is It Clean? Why do You Want to Know? Part II

Hymes, Les
August 2002
Circuits Assembly;Aug2002, Vol. 13 Issue 8, p26
Trade Publication
Discusses the appropriate process control tests for monitoring contamination levels on printed circuit assemblies. Establishment of the total soldering and cleaning process; Use of definitive process control regime; Application of ionic conductivity cleanliness evaluation test.


Related Articles

  • Can You Clean a No-Clean Assembly? Munson, Terry // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p48 

    Focuses on no trouble found (NTF) point in hand-soldered connector on the wave solder side of the assembly. Causes of the NTF problems; Impact of no-clean fluxes on electrical performance of the product; Techniques employed for determining NTF points.

  • How to match a reflow oven to your needs. Schedtler, Dick // Process Heating;Sep/Oct95, Vol. 2 Issue 5, p47 

    Discusses the soldering of printed circuit boards in the printed circuit industry. Attachment of components to circuit boards; Infrared heating; Limitations of infrared radiation; Convection heating as an alternative. INSET: Solder subtleties and flux without flex..

  • Reworking Lead-free Solder in PCB Assembly. Dongkai Shangguan // SMT: Surface Mount Technology;Jun2003, Vol. 17 Issue 6, p38 

    Discusses factors to be considered during lead-free solder rework in printed circuit board assembly. Lack of wetting and wickability in lead-free solder rework; Minimization of negative impact of the rework process on the reliability of the solder interconnects; Electrochemical reliability.

  • How To Succeed In Soldering. Campisi, Jr., Skip // Electronics Now;Jul99, Vol. 70 Issue 7, p84 

    Offers advice about soldering. Selection of the correct tools and solder; Printed circuits; Techniques to use that guarantee success; Importance of tip maintenance.

  • Avoiding the Pressure. Nguyen, Nathalie; Robertson, Glenn; Schlak, Robert; Do, Trent // Printed Circuit Design;Nov2002, Vol. 19 Issue 11, p12 

    Focuses on the avoidance of a soldering-related problems using a compliant pin technology. Attachment of high-speed interconnects to the printed circuit design; Consideration of the insertion force; Reliability of the pin.

  • Hand Soldering in the 21st Century. Huerta, Leo // Circuits Assembly;Sep2002, Vol. 13 Issue 9, p44 

    Focuses on the significance of hand soldering process in assembling the printed circuit board system. Control of the amount of thermal energy; Tips on avoiding thermal damage; Importance of flux in the soldering process.

  • Novel Materials for Printing SOLDERABLE SILVER CIRCUITS. Jablonski, Greg // PC FAB;Oct2001, Vol. 24 Issue 10, p14 

    Discusses the use of novel materials for printing solderable silver circuits. Elimination of etching with the use of a novel silver ink-polymide combination; Comparison of the novel process to the subtractive process for producing flexible circuits; Benefits of using novel silver ink; Potential...

  • Selective Fluxing Comes of Age. Erickson, Stuart; Cote, Christopher // Circuits Assembly;Apr2002, Vol. 13 Issue 4, p30 

    Focuses on the functions of wave soldering in the manufacturing processes of electronic products. Improvement of processes to increase yields and reduce costs; Reliability of the manufacturing technology; Aspects of wave soldering in the application of liquid flux to printed circuit boards.

  • Advanced Rework Technology and Processes for Next-Gen Packages. Czaplicki, Brian // SMT: Surface Mount Technology;Nov2013, Vol. 28 Issue 11, p16 

    BGA rework is now largely mature, although new supplemental processes that provide improved process control such as solder paste dipping and non-contact site cleaning can now be integrated into existing processes if the rework technology that is used allows. So, what is the next set of...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics