TITLE

DENSCO and Japan Gore-Tex Develop New Product

AUTHOR(S)
Shedd, John
PUB. DATE
August 2002
SOURCE
Circuits Assembly;Aug2002, Vol. 13 Issue 8, p20
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports the joint efforts between DENSCO Corp. and Gore-Tex Inc. to develop a copper lad laminate use in patterned prepreg layout process board in Japan. Increase in the demand for miniature electronic products; Description of the multi-layered printed circuit board.
ACCESSION #
7211475

 

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