TITLE

Wafer-Level Packaging Reduces Cost, Spurs Recovery

AUTHOR(S)
Richter, Franz
PUB. DATE
July 2002
SOURCE
Electronic News;7/15/2002, Vol. 48 Issue 29, p20
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reveals that many U.S. companies are investing in equipment for water-level bumping and packaging. Advantage of carrying out the assembly and packaging on the water level; Challenge of water-level packaging for integrated circuit manufacturers.
ACCESSION #
7001360

 

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