TITLE

Thermal simulation of heterogeneous structural components in microelectronic devices

AUTHOR(S)
Gavrysh, V. I.; Fedasyuk, D. V.
PUB. DATE
October 2010
SOURCE
Semiconductor Physics, Quantum Electronics & Optoelectronics;2010, Vol. 13 Issue 4, p439
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered.
ACCESSION #
69749682

 

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