MEMS for Mobile Communications

Ermolov, Vladimir; Nieminen, Heikki; Nybergh, Kjell; Ryhanen, Tapani; Silanto, Samuli
July 2002
Circuits Assembly;Jul2002, Vol. 13 Issue 7, p46
Trade Publication
Focuses on the role of packaging in determining the total cost and overall size of microsystems in electronic manufacturing in the U.S. Performance of microelectromechanical systems; Nature of wafer-level of zero packaging; Technological drivers in wireless applications.


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