TITLE

MEMS for Mobile Communications

AUTHOR(S)
Ermolov, Vladimir; Nieminen, Heikki; Nybergh, Kjell; Ryhanen, Tapani; Silanto, Samuli
PUB. DATE
July 2002
SOURCE
Circuits Assembly;Jul2002, Vol. 13 Issue 7, p46
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the role of packaging in determining the total cost and overall size of microsystems in electronic manufacturing in the U.S. Performance of microelectromechanical systems; Nature of wafer-level of zero packaging; Technological drivers in wireless applications.
ACCESSION #
6934988

 

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