TITLE

Array Package Rework--Lead Free Throws a Curve

AUTHOR(S)
Rupprecht, Howard
PUB. DATE
July 2002
SOURCE
Circuits Assembly;Jul2002, Vol. 13 Issue 7, p30
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the importance of correct reflow profiles and automated equipment to successful reworking array packages for electronics manufacturing in the U.S. Limitation of additional functionality; Significance of cost as the ultimate industry driver; Application of land grid arrays.
ACCESSION #
6934640

 

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