TITLE

Surface-Mount Solder Attachments

AUTHOR(S)
Crawford, Jack; Engelmaier, Werner
PUB. DATE
July 2002
SOURCE
Circuits Assembly;Jul2002, Vol. 13 Issue 7, p28
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the impact of questionable test regimens and extravagant claims for IPC to develop a standard to ensure proper solder joint reliability in the U.S. Importance of design for reliability for proper performance; Identification of the accelerated testing issues; Reliability of the test requirements.
ACCESSION #
6934569

 

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