Surface-Mount Solder Attachments

Crawford, Jack; Engelmaier, Werner
July 2002
Circuits Assembly;Jul2002, Vol. 13 Issue 7, p28
Trade Publication
Focuses on the impact of questionable test regimens and extravagant claims for IPC to develop a standard to ensure proper solder joint reliability in the U.S. Importance of design for reliability for proper performance; Identification of the accelerated testing issues; Reliability of the test requirements.


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