TITLE

CSp Implementation

AUTHOR(S)
Beddingfield, S. Craig
PUB. DATE
July 2002
SOURCE
Circuits Assembly;Jul2002, Vol. 13 Issue 7, p26
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Provides several guidelines in ensuring successful incorporation of chip-scale packaging and flip chip attach. Importance of proper design; Emphasis on initial design; Specification of board pad size design.
ACCESSION #
6934506

 

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