The Package

Levine, Bernard
June 2002
Electronic News (10616624);6/10/2002, Vol. 48 Issue 24, p38
Trade Publication
Presents an update on the packaging sector of the electronics industry in the U.S. as of June 10, 2002. Preview of the Nepcon East and Electro trade shows in Boston, Massachusetts starting June 11, 2002; Tantalum surface-mount capacitor line introduced by Kemet Electronics Corp.; Description of the multilayer band pass filter for wireless applications, introduced by Murata Electronics.


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