TITLE

The Package

AUTHOR(S)
Levine, Bernard
PUB. DATE
June 2002
SOURCE
Electronic News;6/10/2002, Vol. 48 Issue 24, p38
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Presents an update on the packaging sector of the electronics industry in the U.S. as of June 10, 2002. Preview of the Nepcon East and Electro trade shows in Boston, Massachusetts starting June 11, 2002; Tantalum surface-mount capacitor line introduced by Kemet Electronics Corp.; Description of the multilayer band pass filter for wireless applications, introduced by Murata Electronics.
ACCESSION #
6810752

 

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