TITLE

Are Lead-Free Solder Joints Reliable?

AUTHOR(S)
Sohn, John E.
PUB. DATE
June 2002
SOURCE
Circuits Assembly;Jun2002, Vol. 13 Issue 6, p32
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports the development of a project aimed at helping electronics manufacturers to produce lead-free printed circuit board assemblies (PCBA) by the National Electronic Manufacturing Initiative. Comparison of the reliability of lead-free PCBA with standard tin-lead PCBA; Focus of the project team on solder joints; Types of PCBA selected for testing.
ACCESSION #
6781674

 

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