TITLE

Substrates for Flip Chip Assembly

AUTHOR(S)
Westby, George
PUB. DATE
June 2002
SOURCE
Circuits Assembly;Jun2002, Vol. 13 Issue 6, p24
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Proposes the use of substrates to reduce flip chip assembly defect levels. Illustration of a problem; Use of a computer simulation technique in optimizing substrate design for the layout; Risks of solder joint bridging and opens.
ACCESSION #
6781668

 

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