An Ounce of Prevention is Worth a Pound of Cure

Hymes, Les
June 2002
Circuits Assembly;Jun2002, Vol. 13 Issue 6, p22
Trade Publication
Presents a question and answer advisory on soldering issues. Implementation of process control in dealing with components and assemblies; Benefits of using automated optical inspection device and thermal imaging techniques in dealing with soldering problems; Techniques used in reworking solder joints attached to heavy ground planes.


Related Articles

  • Is It Clean? Why do You Want to Know? Part II. Hymes, Les // Circuits Assembly;Aug2002, Vol. 13 Issue 8, p26 

    Discusses the appropriate process control tests for monitoring contamination levels on printed circuit assemblies. Establishment of the total soldering and cleaning process; Use of definitive process control regime; Application of ionic conductivity cleanliness evaluation test.

  • Pre-Reflow, Inline, 3-D Inspection. Weisgerber, John; Tan, Doreen // Circuits Assembly;Nov2003, Vol. 14 Issue 11, p34 

    Manufacturers of today's advanced electronics-based products know that simultaneously meeting goals of producing a cost competitive product, while continuing to meet or exceed their customers' quality expectations, is important. In general, inline inspection is most valuable when used to detect...

  • REAL-TIME ULTRASONIC EXPULSION DETECTION AND INDENTATION MEASUREMENT IN RESISTANCE SPOT WELDS. Karloff, Anthony C.; Chertov, A. M.; Gr. Maev, R. // AIP Conference Proceedings;2/22/2010, Vol. 1211 Issue 1, p1609 

    The thickness of a resistance spot weld resulting from electrode indentation is an important quality control parameter for estimating the final nugget diameter and identifying the occurrence of expulsion. An ultrasound transducer has been installed in a welding electrode allowing for evaluation...

  • Lead-Free Reflow Process Control. Dimock, Fred; Fischbeck, Karl // SMT: Surface Mount Technology;Sep2004, Vol. 18 Issue 9, p68 

    Considers statistical process control (SPC) for lead-free soldering reflow. Process window for lead-free solders; Self-controlling systems for precision reflow ovens; Linking of the reflow oven SPC into the overall production line.

  • STEP 2: Process Control. Barbini, Denis // SMT: Surface Mount Technology;Feb2007, Vol. 21 Issue 2, p55 

    The article presents information on issues related to the effective joint formation technology. Apart from the lead free processing, other challenges that involve material selection, cost minimization and equipment functionality, innovative solutions to incorporate the process control is also...

  • Pb-Free Synthesis: Decision Matrix as a Tool for Alloy Selection. Quintero, Pedro O.; Valentin, Ricky; Ma, David // Journal of Microelectronic & Electronic Packaging;2010 1st Quarter, Vol. 7 Issue 1, p25 

    For aerospace products, there is no current legislation or directive that sets a schedule for transitioning to Pb-free electronics; however, the aerospace industry is likely to be swept along because of its dependence on the larger commercial electronics industry which has already changed its...

  • Advanced Rework Technology and Processes for Next-Gen Packages. Czaplicki, Brian // SMT: Surface Mount Technology;Nov2013, Vol. 28 Issue 11, p16 

    BGA rework is now largely mature, although new supplemental processes that provide improved process control such as solder paste dipping and non-contact site cleaning can now be integrated into existing processes if the rework technology that is used allows. So, what is the next set of...

  • Test Strategy Tips and Tricks. Johnson, Stacy Kalisz // Circuits Assembly;Sep2007, Vol. 18 Issue 9, p50 

    The article offers recommendations for the selection of an optimum test strategy among solder paste inspection (SPI), AOI and automated x-ray inspection, or in-circuit. Inspection systems such as SPI and AOI usually show a better return on capital investment than increasing labor costs, which...

  • IPC Revises IPC-A-610D and J-STD-001D Standards. Crawford, Jack // SMT: Surface Mount Technology;Apr2005, Vol. 19 Issue 4, p4 

    The article reports that the Institute for Interconnecting and Packaging Electronic Circuits (IPC) has revised IPC-A-610D and J-STD-001D standards. J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, requires process-control methodology and provides acceptability...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics