TITLE

Solutions in Solder Paste

AUTHOR(S)
Ferry, Jeff
PUB. DATE
January 2002
SOURCE
Circuits Assembly;Jan2002, Vol. 13 Issue 1, p74
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the improvement of ball grid array (BGA) rework system. Application of stenciling solder paste in to the BGA component; Method of preparing a BGA component; Use of metal stencil in the stencilling process.
ACCESSION #
6611899

 

Related Articles

  • Anatomy of a Correct THERMAL PROFILE. ILUSTRE, SIMON // Circuits Assembly;Oct2009, Vol. 20 Issue 10, p30 

    The article explains the anatomy of the correct thermal profile of BGA-laden printed circuit boards (PCB) and offers guidelines for optimum temperature settings relating to a particular solder paste. It outlines the steps for setting up temperatures of a double-sided, ball grid array...

  • BGA Repair for Mixed Assemblies.  // Circuits Assembly;May2006, Vol. 17 Issue 5, p54 

    This article provides information on ball grid array (BGA) repair for mixed assemblies. BGA devices are especially sensitive to mixed solders in the rework process. Studies of BGA assembled with mixed solder technologies show successes and some areas of concern. The biggest problem arises when...

  • Impact of processing conditions and solder materials on surface mount assembly defects. Sidhu, Rajen; Aspandiar, Raiyo; Vandervoort, Steve; Amir, Dudi; Murtagian, Gregorio // JOM: The Journal of The Minerals, Metals & Materials Society (TM;Oct2011, Vol. 63 Issue 10, p47 

    The conversion to lead-free solder alloys and increasing dynamic warpage due to the coefficient of thermal expansion (CTE) mismatch and thinner microelectronic packaging technology has resulted in a significant increase in the risk of solder joint defects for ball grid array (BGA) components....

  • In Case You Missed It.  // Printed Circuit Design & Fab: Circuits Assembly;Oct2014, Vol. 31 Issue 10, p48 

    The section presents abstracts of papers published in previous issues of the journal "Printed Circuit Design & Fab: Circuits Assembly" which cover topics such as solder pastes, solder joints and ball grid arrays.

  • Solder charge - the alternative to BGA. Endres, Herbert // Electronics Weekly;10/22/2008, Issue 2357, p20 

    The article focuses on the use of solder charge instead of ball grid array (BGA) to meet the demands of high density mezzanine connector market. BGA had some drawbacks in it including solder wicking during reflow, missing connections and coplanarity. In the solder charge concept, a blanked...

  • Waste Not, Want Not. Ferry, Jeff // Circuits Assembly;Apr2003, Vol. 14 Issue 4, p48 

    The article presents a procedure that will simplify ball grid array (BGA) rework. Leftover solder is commonly removed from the site after rework, but prepping the pads, depositing fresh solder paste, placing the new BGA and heating the board takes time. The irregular solder pattern may result in...

  • Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 °C. Po-Cheng Shih; Kwang-Lung Lin // Journal of Materials Research;Jan2007, Vol. 22 Issue 1, p2 

    Sn-8Zn-3Bi solder paste and Sn-3.2Ag-0.5Cu solder balls were reflowed simultaneously at 240 °C on Cu/Ni/Au metallized ball grid array substrates. The joints without Sn-Zn-Bi addition (only Sn-Ag-Cu) were studied as a control system. Electrical resistance was measured after multiple reflows...

  • Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing. Liu, Ziyu; Cai, Jian; Wang, Qian; He, Xi; Chen, Yu // Journal of Electronic Materials;Sep2014, Vol. 43 Issue 9, p3341 

    In this work, solder balls in ball grid array packaging technology with the pitch of 300 μm were fabricated by stencil printing solder paste and then reflowed at high temperature. In order to evaluate the quality of solder ball after printing and reflowing processes, the mechanical...

  • Jetting Strategies for mBGAs: A Question of Give and Take. Mårtensson, Gustaf; Kurian, Thomas // SMT: Surface Mount Technology;Apr2015, Vol. 30 Issue 4, p56 

    The article presents a study that examines the effect of piezo actuation profile on deposit quality in terms of shape, positioning, and satellite levels for proper deposition applications. It states that the jetting in the study was performed using a MY500 jet printer. Other topics include...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics