TITLE

Going Mainstream with Chip-on-Board

AUTHOR(S)
Luthra, Mukul
PUB. DATE
January 2002
SOURCE
Circuits Assembly;Jan2002, Vol. 13 Issue 1, p33
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the wire bonding process of chip-on-board (COB) and integrated circuit packaging in the U.S. Description of COB technologies; Use of ribbon bonding of gallium-arsenide devices in the radio frequency modules; Types of wire bonding.
ACCESSION #
6611864

 

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics