Going Mainstream with Chip-on-Board

Luthra, Mukul
January 2002
Circuits Assembly;Jan2002, Vol. 13 Issue 1, p33
Trade Publication
Focuses on the wire bonding process of chip-on-board (COB) and integrated circuit packaging in the U.S. Description of COB technologies; Use of ribbon bonding of gallium-arsenide devices in the radio frequency modules; Types of wire bonding.


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