TITLE

Managing CSP Underfill Processes

AUTHOR(S)
Adamson, Steven J.; Wheatley, Barry; Murch, Frank
PUB. DATE
January 2002
SOURCE
Circuits Assembly;Jan2002, Vol. 13 Issue 1, p26
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the underfill dispensing process of electronic products in the U.S. Types of electronic components; Description of chip-scale package; Use of dual conveyor lanes in the dispensing systems.
ACCESSION #
6611860

 

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