TITLE

Cleaning a No-Clean

AUTHOR(S)
Munson, Terry
PUB. DATE
December 2001
SOURCE
Circuits Assembly;Dec2001, Vol. 12 Issue 12, p66
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Presents a non-fluid, invasive method for removing rework residues on a circuit board. Disadvantages of using a water-soluble hand solder flux; Comparative analysis of reworked boards before and after cleaning; Effectiveness of the method.
ACCESSION #
6611750

 

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