TITLE

Materials and Process Considerations for Lead-Free Electronics Assembly

AUTHOR(S)
Seelig, Karl; Suraski, David
PUB. DATE
December 2001
SOURCE
Circuits Assembly;Dec2001, Vol. 12 Issue 12, p30
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Compares the reliability testing results and process considerations for alloys. Contribution of tin/silver alloy in hybrid and electronics assembly industry; Concern on the patent legislation of alloys; Temperature of the melting point of the alloys.
ACCESSION #
6611733

 

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