Materials and Process Considerations for Lead-Free Electronics Assembly

Seelig, Karl; Suraski, David
December 2001
Circuits Assembly;Dec2001, Vol. 12 Issue 12, p30
Trade Publication
Compares the reliability testing results and process considerations for alloys. Contribution of tin/silver alloy in hybrid and electronics assembly industry; Concern on the patent legislation of alloys; Temperature of the melting point of the alloys.


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