TITLE

NEPCON East Product SPOTLIGHT

PUB. DATE
May 2002
SOURCE
Circuits Assembly;May2002, Vol. 13 Issue 5, p53
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Evaluates several products and equipment related to printed circuits in the U.S. Use of AsahiKlin AK-225 for removing flux-residue from circuit boards; Capabilities of S8 APO stereomicroscope; Advantages of NC253 pin probeable, no-clean solder paste.
ACCESSION #
6582325

 

Related Articles

  • Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board. Lin, Chi-pu; Chen, Chih-ming // Journal of Electronic Materials;Jun2009, Vol. 38 Issue 6, p908 

    Immersion Ag is a promising candidate Pb-free surface finish on printed circuit boards (PCBs). For flexible PCB and optoelectronic packaging, solid-state bonding rather than reflow is commonly used to join the chips to the PCB with Sn-based solders, after which the immersion Ag layer remains at...

  • Contact image sensors speed solder-paste printing. Wilson, Andrew // Vision Systems Design;May2012, Vol. 17 Issue 5, p13 

    The article offers information on the use of the automated optical inspection (AOI) tool that is based from the contact image sensor (CIS) of Tichawa Vision by Kurtz Ersa Group for its solder-paste printing. It mentions the development of the Ersa Versaprint solder-paste printer that features...

  • Rework Site Printing using Mini Stencils--Plastic Adhesive vs. Metal. Wettermann, Bob // SMT: Surface Mount Technology;Feb2016, Vol. 31 Issue 2, p70 

    The article focuses on a study comparing earlier used miniature metal stencil with recent plastic film stencils having adhesive approach for surface-mount technology printing process. Topics discussed include disadvantages of the mini metal stencils such as large size and difficulty in retaining...

  • Assessment of low-temperature fluxes. Plas, Hubert A. Vande; Cinque, Russell B. // Hewlett-Packard Journal;Aug96, Vol. 47 Issue 4, p99 

    Evaluates the wetting balance as a technique for studying the flux activity of low-temperature solder paste fluxes. Replacement of PbSn eutectic solder with eutectic solder alloy; Melting point; Experimental procedure; Equilibrium wetting force.

  • Solder Paste Migration: Are you vacuuming the right way? WILLIS, BOB // Printed Circuit Design & Fab: Circuits Assembly;Jan2020, Vol. 37 Issue 1, p45 

    No abstract available.

  • Stop the HOP.  // Circuits Assembly;Aug2008, Vol. 19 Issue 8, p33 

    The article offers tips on dealing with head-on-pillow (HOP) failures in printed circuit boards (PCB). HOP refers to the possible non-wetting between the paste and solder balls. To confirm HOP failures, it is necessary to conduct destructive analysis. In the case given, optical microscopy showed...

  • Copper Tin Intermetallic Crystals' Role in Formation of Microbridges Between Leads, Part II. Kukelhan, Jeff // SMT: Surface Mount Technology;Dec2010, Vol. 25 Issue 8, p24 

    Unless the solder in a reservoir is regularly changed, the dissolved copper reaches a point of saturation, forming orthorhombic Cu6Sn5 crystals. Solder drawn from a saturated pot can solidify into joints whose surface finish exhibits many needle-like metallic protrusions. This paper documents...

  • Standardization of a shear test method for lead-free solder paste chip joints. Choi, Jai-Kyoung; Park, Jai-Hyun; Ahn, Yong-Sik // Journal of Materials Science;Sep2007, Vol. 42 Issue 17, p7451 

    The electronics industry is moving to replace Pb-based solder with Pb-free solder because of the growing environmental regulations governing the use of lead. Solder joints made from Pb-free solder paste do not yet have an evaluation method to classify its mechanical properties such as shear...

  • Microstructural evolution and mechanical properties of SnAgCu alloys. Fouassier, O.; Heintz, J.-M.; Chazelas, J.; Geffroy, P.-M.; Silvain, J.-F. // Journal of Applied Physics;8/15/2006, Vol. 100 Issue 4, p043519 

    Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have...

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics