TITLE

A Cure for BGA's Warped Sense of Humor

AUTHOR(S)
Ferry, Jeff
PUB. DATE
May 2002
SOURCE
Circuits Assembly;May2002, Vol. 13 Issue 5, p51
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the occurrence of distortion in ball grid array (BGA) components and circuit boards. Relation between the size of BGA and deflection; Effect of warpage on the circuit board surface; Solution to warpage.
ACCESSION #
6582320

 

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