Enhance Your BGA X-Ray Inspection Process

Zweig, Gil
May 2002
Circuits Assembly;May2002, Vol. 13 Issue 5, p47
Trade Publication
Focuses on the use of x-ray inspection for quality control of ball grid array bonding in surface-mount assembly. Advantage of understanding x-ray signatures; Use of signature identification entails detecting x-ray image variation; Usage of a side-viewing optical microscopic probe.


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