TITLE

New Study Reveals Component Defect Levels

AUTHOR(S)
Oresjo, Stig
PUB. DATE
May 2002
SOURCE
Circuits Assembly;May2002, Vol. 13 Issue 5, p39
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Examines the defect levels for different component types of printed circuit board assembly. Average levels defects; Most common defects; Use of ball grid arrays.
ACCESSION #
6582307

 

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