TITLE

SMT/HYBRID/PACKAGING 2002 to Arrive in Germany

PUB. DATE
May 2002
SOURCE
Circuits Assembly;May2002, Vol. 13 Issue 5, p10
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Highlights the SMT/HYBRID/PACKAGING 2002 conference in Nuremberg, Germany. Packaging of optoelectronics and microsystems; Use of the conference and exhibition as a platform to present solutions on system integration in microelectronics.
ACCESSION #
6582217

 

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