TITLE

Reflow Process Anomalies

AUTHOR(S)
Hymes, Les
PUB. DATE
April 2002
SOURCE
Circuits Assembly;Apr2002, Vol. 13 Issue 4, p24
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Presents answers to questions regarding the causes of parallel ripples or lines on the surface of reflowed solder joints. Possibility of the formation of alloy out of reflow pass; Use of intrusive reflow process to solder leaded items; Deposition of paste during operations.
ACCESSION #
6420122

 

Related Articles

  • Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys. Tucker, J.; Chan, D.; Subbarayan, G.; Handwerker, C. // Journal of Electronic Materials;Apr2012, Vol. 41 Issue 4, p800 

    A correction is presented to the article "Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys," by J. P. Tucker, D. K. Chan, G. Subbarayan, and C. A. Handwerker from the Volume 41 Number 3, 2012 issue.

  • New Pb-free solder alloy with superior mechanical properties. McCormack, M.; Jin, S. // Applied Physics Letters;7/5/1993, Vol. 63 Issue 1, p15 

    Develops a lead-free solder alloy based on the strontium-gold-zinc system. Comparison of the phase distributions of zinc and binary alloy; Effects of zinc on the mechanical strength of strontium; Impact of zinc on the solidification microstructure of the alloy.

  • Fatigue resistant, high temperature solder. Gayle, Frank // Advanced Materials & Processes;Apr2001, Vol. 159 Issue 4, p43 

    Reports on the completion of the program of the National Center for Manufacturing Sciences (NCMS) to identify and evaluate fatigue-resistant solder alternatives to high-lead solder alloys. Purpose of the High Temperature Fatigue Resistant Solder Project; Details on the selection of suitable...

  • Lead-free alloys analysed for thermal performance.  // Electronics Weekly;6/18/2003, Issue 2104, p5 

    Deals with a study for the analysis of the properties of three alloys for a lead-free solder assembly by trade association IPC. Areas to be analyzed in the study; Supporters of the study; Schedule for the study's completion.

  • BRAZING 20Q&A. SHAPIRO, ALEXANDER E. // Welding Journal;Aug2013, Vol. 92 Issue 8, p20 

    The article provides an answer to a question related to welding particularly on the mechanical behavior of brazed joints of dissimilar metals at cryogenic thermal cycling.

  • Wetting reaction versus solid state aging of eutectic SnPb on Cu. Tu, K. N.; Lee, T. Y.; Jang, J. W.; Li, L.; Frear, D. R.; Zeng, K.; Kivilahti, J. K. // Journal of Applied Physics;5/1/2001, Vol. 89 Issue 9, p4843 

    The reaction kinetics of eutectic SnPb solder on Cu were studied and compared in the liquid state at 200 to 240 °C and in the solid state aged at 125-170 °C. The ternary phase diagrams of SnPbCu, the morphology of intermetallic compound (IMC), and the kinetics of growth of the...

  • GETTING THE 'L' OUT OF HASL. Lawrence, Brigitte; Eichhorst, Timothy // Printed Circuit Design & Manufacture;Aug2004, Vol. 21 Issue 8, p39 

    Focuses on various forms of lead-free alloys. Structural and conductive properties of alloys; Melting point of eutectic tin-lead; Advantage of using tin-silver solder substitutes.

  • Three-dimensional morphology of a very rough interface formed in the soldering reactions between.... Kim, H.K.; Liou, H.K. // Applied Physics Letters;5/1/1995, Vol. 66 Issue 18, p2337 

    Investigates the interfacial morphology of the Cu-Sn compounds formed in the soldering reaction between a eutectic SnPb alloy and copper. Utilization of scanning electron microscopy in the study; Presentation of the three-dimensional morphology of the Cu-Sn compounds; Impact of the growth of...

  • Room-Temperature Indentation Creep of Lead-Free Sn-5%Sb Solder Alloy. Geranmayeh, A. R.; Mahmudi, R. // Journal of Electronic Materials;Jul2005, Vol. 34 Issue 7, p1002 

    Creep behavior of the lead-free Sn-5%Sb solder alloy was studied by long-time Vickers indentation testing at room temperature. Four different conditions of the material were examined. These were unhomogenized cast (UC), homogenized cast (HC), unhomogenized wrought (UW), and homogenized wrought...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics