Reflow Process Anomalies

Hymes, Les
April 2002
Circuits Assembly;Apr2002, Vol. 13 Issue 4, p24
Trade Publication
Presents answers to questions regarding the causes of parallel ripples or lines on the surface of reflowed solder joints. Possibility of the formation of alloy out of reflow pass; Use of intrusive reflow process to solder leaded items; Deposition of paste during operations.


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