TITLE

Interface of directly bonded InP wafers for vertical couplers

AUTHOR(S)
Jin-Phillip, N.Y.; Liu, B.; Bowers, J.E.; Hu, E.L.; Kelsch, M.; Thomas, J.; Rühle, M.
PUB. DATE
February 2002
SOURCE
Applied Physics Letters;2/25/2002, Vol. 80 Issue 8, p1346
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines the structure of the interface of directly bonded InP wafers for vertical couplers. Accommodation of the tilt misorientation between two wafers without introducing extra misfits; Identification of the size of nanometers; Excess optical loss of the coupler based on the directly bonded InP wafers.
ACCESSION #
6410923

 

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