TITLE

Enhanced tensile ductility and toughness in nanostructured Cu

AUTHOR(S)
Wang, Y. M.; Ma, E.; Chen, M. W.
PUB. DATE
April 2002
SOURCE
Applied Physics Letters;4/1/2002, Vol. 80 Issue 13, p2395
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Pure copper with ultrafine grain sizes and nanoscale subgrain (dislocation) structures was prepared by using severe plastic deformation through cold rolling at subambient temperatures, with or without subsequent recovery annealing. We report coexisting high strength and tensile ductility (large elongation to failure and ductile fracture). Factors leading to the simultaneous strengthening and toughening with increasing cold deformation and microstructural refinement are discussed.
ACCESSION #
6391189

 

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