Through-Hole Rework of Thermal Dissipating Assemblies

Garnick, Richard; Wachter, Ronald
March 2002
Circuits Assembly;Mar2002, Vol. 13 Issue 3, p42
Trade Publication
Focuses on the development of method incorporating computer control of temperature, time and motion of solder pot modules and preheaters. Steps for the successful through-hole repair method; Use of hot gas system to remove the solder from the barrels; Assessment on the controlled process of rework method.


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