TITLE

Optimizing Printer-Based Solder Paste Inspection

AUTHOR(S)
Morini, John; Cronin, John; O'Neal, Dennis
PUB. DATE
March 2002
SOURCE
Circuits Assembly;Mar2002, Vol. 13 Issue 3, p32
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Examines the optimizing printer-based solder paste inspection with statistical process control (SPC). Influence of SPC on the quality and profitability of printed circuit board; Tolerance level for defects of production in electronic manufacturing industry; Lists of software tools and data models used for solder printing.
ACCESSION #
6268207

 

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