New No-Lead Solder Pastes and Reflow Techniques

Raby, Jim; Heller, David
March 2002
Circuits Assembly;Mar2002, Vol. 13 Issue 3, p28
Trade Publication
Evaluates the quality of intermetallic bonding and the prevalence of voids on no-lead formulations and fluxes of solder pastes and reflow techniques. Conjunction between no-lead solder alloys and copper pads covered with organic soderability preservatives; Use of immersion tin in the study; Occurrence of large voids in the filletes of quad flat pack leads.


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