Sub-wavelength micromachining of silica glass by irradiation of CO laser with Fresnel diffraction

Okazaki, K.; Torii, S.; Makimura, T.; Niino, H.; Murakami, K.; Nakamura, D.; Takahashi, A.; Okada, T.
August 2011
Applied Physics A: Materials Science & Processing;Aug2011, Vol. 104 Issue 2, p593
Academic Journal
We investigated a simple and productive micromachining method of silica glass by ablation using a TEA CO laser (10.6 μm) with a spatial resolution down to sub-wavelength scale. The silica glass was irradiated by the TEA CO laser light through a copper grid mask with square apertures of 20×20 μm attached to the silica glass surface. After the irradiation, circular holes with a diameter of several μm were formed on the silica glass surface at the centers of the apertures due to the Fresnel diffraction effect. The minimum diameter of the holes was 3.4 μm. The characteristics of the micromachining are discussed based on the electric field distributions of the CO laser light under the mask using a three-dimensional full-wave electromagnetic field simulation.


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