Quality assessment of bond interfaces by nonlinear ultrasonic transmission

Hirsekorn, S.; Koka, A.; Wegner, A.; Arnold, W.
May 2000
AIP Conference Proceedings;2000, Vol. 509 Issue 1, p1367
Academic Journal
Quality assessment of bond interfaces in composite materials is an important task in nondestructive materials testing. Techniques to characterize or even measure the bond strength are required. Binding forces are nonlinear and cause a nonlinear modulation of transmitted or reflected ultrasonic waves. Therefore, the generated higher harmonics of an insonified monochromatic wave will give information about the quality of adhesive bonds. This paper presents the basic physical model of this technique and investigations of the adherence of coatings on carbon-fiber reinforced carbon samples and of the bond interface in fusion-welded silicon wafers exploiting the nonlinear transmission of ultrasound. Some of the results are compared to destructive tests. © 2000 American Institute of Physics.


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