TITLE

Experimental research of active thermal testing of the printed circuit board holes

AUTHOR(S)
Plotnikov, Y.; Poliakhov, M.; Chernov, L.
PUB. DATE
May 2000
SOURCE
AIP Conference Proceedings;2000, Vol. 509 Issue 1, p1911
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
There was developed a new method of active thermal PCB holes metallization thickness testing which helps to solve the problem of PCB holes 0.3–0.6 mm diameter testing where existing methods (eddy-current, contact method of electric resistance) have considerable limitations. The method is based on analyzing parameters of non-steady thermal disturbance, propagating from one edge of metallization tube to the other. In experimental work, PCBs were used with sets of holes having diameters from 0.3 to 1.1 mm and metallization thickness from 0 to 50 μm. The temperature of the upper metallization tube edge (opposite to the heated) smoothly increases, reaches its maximum and then falls to initial value (before heating). The form of temperature curve, the arrival time of temperature maximum (appr. 1–2 sec. after the heating starts) and the temperature maximum value all depend mainly on metallization thickness and diameter of the hole. It was found that thermal response signal also depends on structural condition of metallization material and metallization-substrate adhesion degree. © 2000 American Institute of Physics.
ACCESSION #
6029169

 

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