TITLE

Thermal eddy current testing of metallization quality of printed circuit boards (PCB)

AUTHOR(S)
Savushkin, D. G.; Polyahov, M. Y.; Chernov, L. A.
PUB. DATE
May 2000
SOURCE
AIP Conference Proceedings;2000, Vol. 509 Issue 1, p1923
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Today the fissile thermal control methods are used often enough to evaluate the metallization quality of printed circuit boards. However, it is necessary to note that the existing difficulties while exciting a non-steady thermal wave. There was offered the thermal input, which allows us to supply heat through the upper edge of a metallizing tube and to register parameters of thermal disturbance from the opposite side. The thermal input represents a hollow metal cone where the thermal disturbance is suggested to be effectuated by eddy currents induced by a coil situated above the thermal input. The agitating current is a kind of radio pulse with a high frequency filling. The field frequency, thickness and the electromagnetic characteristics of the thermal input were selected so that the field couldn’t propagate into space beneath the thermal input. It is possible to evaluate some parameters of the metallizing tube registering from the other side of the printed circuit board the thermal disturbance parameters (e.g. the arrival time of maximum and amplitude). The numerical calculations were made with a specially developed software with the purpose of obtaining the dependence of the arrival time of maximum and the thermal disturbance amplitude upon a printed circuit board metallization layer, the hole diameter, the board thickness, the metallization tube conductivity, the contact pad diameter. The heat exchange with the board material was not taken into account when making calculations because the thermal disturbance propagation time along the metallization tube is too short and this assumption does not make a considerable error. © 2000 American Institute of Physics.
ACCESSION #
6029167

 

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