TITLE

Development of MEMS Power Sensor Package

AUTHOR(S)
Kim, Bruce C.; Kasim, Rahim
PUB. DATE
September 2010
SOURCE
Journal of Microelectronic & Electronic Packaging;2010 3rd Quarter, Vol. 7 Issue 3, p169
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
This article presents the design, fabrication, and packaging of advanced MEMS in high power applications. The advanced MEMS devices are used as a power sensor to detect high current in a distributed power network. We designed and fabricated an M× N array of low power MEMS switches to handle high power which are mass actuated by an external magnetic field. The array of MEMS devices has been packaged in a conventional package and testing was performed to validate its operation. The switching time was very compatible with the existing solid state switches with much higher order of power capability.
ACCESSION #
60072770

 

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