Development of MEMS Power Sensor Package

Kim, Bruce C.; Kasim, Rahim
September 2010
Journal of Microelectronic & Electronic Packaging;2010 3rd Quarter, Vol. 7 Issue 3, p169
Academic Journal
This article presents the design, fabrication, and packaging of advanced MEMS in high power applications. The advanced MEMS devices are used as a power sensor to detect high current in a distributed power network. We designed and fabricated an M× N array of low power MEMS switches to handle high power which are mass actuated by an external magnetic field. The array of MEMS devices has been packaged in a conventional package and testing was performed to validate its operation. The switching time was very compatible with the existing solid state switches with much higher order of power capability.


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