TITLE

MEMC Prices Upsized $550M HY Offer

AUTHOR(S)
Sheahan, Matthew
PUB. DATE
March 2011
SOURCE
High Yield Report;3/7/2011, Vol. 22 Issue 10, p26
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article reports on an upsized junk bond deal worth 500 million U.S. dollars issued by MEMC Electronic Materials.
ACCESSION #
59240325

 

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